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Originally published by Capital Business
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business
October 18, 2025
13h ago

India’s first commercially packaged multi-chip module sent to US firm AOS

India’s first commercially packaged multi-chip module sent to US firm AOS

Oct 18— India’s first commercially packaged multi-chip module (MCM) has rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) Kenya breaking news | Kenya news today |..

✨ Key Highlights

India's first commercially packaged multi-chip module (MCM) has been dispatched from Kaynes Semicon's Sanand OSAT facility to California-based Alpha &Omega Semiconductor (AOS), marking a significant step for India's semiconductor industry.

  • Approximately 900 intelligent power modules (IPMs), featuring 17 dies each, were sent to AOS.
  • The Sanand OSAT facility, supported by ₹1,653.5 crore from the Centre under the India Semiconductor Mission 1.0 (ISM), aims for a total capacity of 6.3 million chips per day when fully operational.
  • This shipment initiates commercial production, with mass production targeted for January 2026, and Kaynes will supply 10 million chips annually to AOS for five years.

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