TECNO’s wild modular smartphone bet: A concept Africa is never supposed to get?
TECNO unveils the world’s thinnest modular smartphone concept at MWC 2026, featuring magnetic snap-on modules, a 4.9mm base design, and bold ambitions for the future of smartphones...
✨ Key Highlights
TECNO is pushing the boundaries of smartphone innovation with its ambitious Modular Magnetic Interconnection Technology, showcased at MWC 2026.
- The concept revives the idea of modular phones but focuses on accessory-driven integration rather than swapping core components, maintaining a slim 4.9mm base device.
- Key players include TECNO and their Product Head of Modular Magnetic Interconnection Technology, Leo Li.
- Over ten magnetic modules are being developed, including power banks, action cameras, and telephoto lenses, connecting via a hybrid system of magnets and pogo-pin connectors.
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