TECNO is pushing the boundaries of smartphone innovation with its ambitious Modular Magnetic Interconnection Technology, showcased at MWC 2026.

• The concept revives the idea of modular phones but focuses on accessory-driven integration rather than swapping core components, maintaining a slim 4.9mm base device.
• Key players include TECNO and their Product Head of Modular Magnetic Interconnection Technology, Leo Li.
• Over ten magnetic modules are being developed, including power banks, action cameras, and telephoto lenses, connecting via a hybrid system of magnets and pogo-pin connectors.