Samsung is set to showcase its advanced AI computing technologies at NVIDIA GTC 2026 in San Jose, California, from March 16-19. The company will highlight its comprehensive AI solutions, from memory to advanced packaging, to enable customers in designing next-generation AI systems.

• The centerpiece will be the new sixth-generation HBM4, now in mass production and designed for the NVIDIA Vera Rubin platform, offering processing speeds of 11.7 Gbps.
• Samsung will also display its next-generation HBM4E, featuring 16 Gbps per pin and 4.0 TB/s bandwidth, and its hybrid copper bonding (HCB) technology.
• The event will also feature demonstrations of Samsung's solutions for NVIDIA AI infrastructure, including the industry-first mass-produced SOCAMM2 memory module and the PM1763 SSD based on the PCIe 6.0 interface.