Xiaomi has officially unveiled its second in-house designed flagship smartphone processor, the Xring O3, manufactured by TSMC on a 3-nanometre process.

• The Xring O3 features a 10-core CPU, a 16-core GPU said to be 85% faster than its predecessor, and supports the new LPDDR6 memory standard, boasting a claimed AnTuTu benchmark score of 5.22 million.
• The chip is set to debut in the Xiaomi 18 Fold, a foldable phone launching in China in September 2026, and the Xiaomi Pad 9 Pro Max tablet.
• This development underscores Xiaomi's ongoing investment in chip development, with founder and CEO Lei Jun committing 50 billion yuan (about $6.9 billion) over ten years.