Technology & Innovation3 stories from 1 sources
Xiaomi Launches Xring O3, TSMC-Built 3nm Chip for September Foldable - August 2026
Xiaomi has officially unveiled its second in-house designed flagship smartphone processor, the Xring O3, manufactured by TSMC on a 3-nanometre process. This chip is specifically built for Xiaomi's upcoming September foldable phone. Meanwhile, TECNO is defying industry trends by launching a thin smartphone, the CAMON Slim, on June 22, 2026, featuring a 6.39mm profile and a competitive price point. Additionally, itel has launched its new Power 80 smartphone in Kenya at a recommended retail price of KES 19,499, boasting exceptional durability and a long-lasting battery built to survive without a case.
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